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Japanese
In the coming 21st century, the capacity of us engaged in the die and mold industry will be exhibited thoroughly in a society in which people's affluent creativity is expected. This results from our accumulated know-how to cope with changes in the economic, social, and industrial structure, including the establishment of international standards, exchanges, cooperation and market creation abroad, securing and training of human resources in Japan, quality development in conjunction with the development of needs, and development of skilled workers and software. With all of these capabilities, the die and mold industry can overcome a single-sale management system and grow into a total engineering industry.
Japan Die and Mold Industry Association will bear a role in supporting the development of member manufacturers while cultivating a next-generation culture.
Japan Die and Mold Industry Association will develop activities with “exhibition of creativity”as its theme.
Guidelines on Prevention of Unintentional
Outflows of Die/mould Blueprints and Processing Data
Contact us
1F Kanagata Nenkin Bldg. 33-12, Yushima ,2-Chome, Bunkyo-ku,Tokyo 113-0034, Japan
TEL:+81-3-6265-1755
FAX:+81-3-6265-1799
E-mail:kanagata@bipc.co.jp